Contacts:
Arman Tuigynbek
Zhanibek Balgin
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Location:
C4, 142
Scanning Electron Microscopy:
Our Thin Film Deposition Lab specializes in advanced thin film fabrication and characterization. It features two magnetron sputtering systems (with RF, DC, and pulsed DC sources), a plasma-enhanced atomic layer deposition (PEALD) system, and a PECVD dual-zone tube furnace. Characterization tools include a spectroscopic ellipsometer (190–2500 nm) and a profilometer, and a laminar flow bench ensuring clean sample handling.
Magnetron Sputtering System I - LAB-18 (Kurt J. Lesker):
The Kurt J. Lesker LAB-18 Sputtering System is used for thin film deposition of various materials, supporting DC magnetron sputtering for metals like Al, Au, Ag, Pt, Cu, Cr, Ti, W, Mo, Hf, and Zr, as well as RF magnetron sputtering for dielectric materials. It also allows reactive sputtering for compound film deposition, including TiN, TiOx, HfOx, and ZrOx. The system can accommodate samples up to 4 inches in diameter, making it suitable for various research applications.
Magnetron Sputtering System II - CMS-18 (Kurt J. Lesker):
The CMS-18 Magnetron Sputtering System (Kurt J. Lesker) is designed for thin film deposition under ultra-high vacuum (UHV) conditions (10⁻⁷ – 10⁻⁸ Torr) with a bakeable chamber and a cryogenic pump. It supports DC magnetron sputtering for metals such as Al, Au, Ag, Pt, Cu, Cr, Ti, W, Mo, Hf, and Zr, as well as RF magnetron sputtering for dielectric materials. The system accommodates samples up to 4 inches in diameter, providing precise control over film quality and composition.
Ultratech FIJI G2 Atomic Layer Deposition System:
The Ultratech FIJI G2 Atomic Layer Deposition (ALD) System supports both thermal ALD and plasma-enhanced ALD (PEALD) for precise, nanoscale thin film deposition. It features four jacket-heated precursor lines and enables the deposition of materials such as Al₂O₃, HfO₂, TiO₂, TiN, ZrO₂, and ZnO₂. The system operates with Ar, O₂, and N₂ as process gases and can accommodate samples up to 200 mm in diameter, making it suitable for a wide range of research and device fabrication applications.
MTI Slidable Dual Zone PECVD Tube Furnace:
The MTI Slidable Dual-Zone PECVD Tube Furnace is designed for plasma-enhanced chemical vapor deposition of materials with precise heating and cooling rate control via a sliding furnace. It features a 300W RF plasma source for enhanced film growth and operates at temperatures up to 1200°C. The system supports Ar, O₂, H₂, CH₄, and C₂H₂ as process gases and utilizes an 80 mm diameter tube furnace, making it suitable for a range of thin film and nanomaterial synthesis applications.
Sentech SENresearch 4.0 Spectroscopic Ellipsometer:
The Sentech SENresearch 4.0 Spectroscopic Ellipsometer is used for thin film thickness and optical property measurements across a wide spectral range from 190 nm (deep UV) to 2500 nm (NIR). It supports various fitting models for different materials and includes additional reflectivity and transmission measurement modes, making it a versatile tool for film characterization in research and industrial applications.
Bruker DektakXT Stylus Profilometer:
The Bruker DektakXT Stylus Profilometer is used for thin and thick film step height and surface roughness measurements. It features a 2 µm stylus, an automated stage, and supports 3D mapping with a scan length of up to 3 mm, providing precise surface characterization for a variety of materials and applications.
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