Contacts:
Alisher Rapikov
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Alisher Rapikov
C4, 137
Our Thin Film Deposition Lab specializes in advanced thin film fabrication and characterization. It features two magnetron sputtering systems (with RF, DC, and pulsed DC sources), a plasma-enhanced atomic layer deposition (PEALD) system, and a PECVD dual-zone tube furnace. Characterization tools include a spectroscopic ellipsometer (190–2500 nm) and a profilometer, and a laminar flow bench ensuring clean sample handling.
The Kurt J. Lesker LAB-18 Sputtering System is used for thin film deposition of various materials, supporting DC magnetron sputtering for metals like Al, Au, Ag, Pt, Cu, Cr, Ti, W, Mo, Hf, and Zr, as well as RF magnetron sputtering for dielectric materials. It also allows reactive sputtering for compound film deposition, including TiN, TiOx, HfOx, and ZrOx. The system can accommodate samples up to 4 inches in diameter, making it suitable for various research applications.
The CMS-18 Magnetron Sputtering System (Kurt J. Lesker) is designed for thin film deposition under ultra-high vacuum (UHV) conditions (10⁻⁷ – 10⁻⁸ Torr) with a bakeable chamber and a cryogenic pump. It supports DC magnetron sputtering for metals such as Al, Au, Ag, Pt, Cu, Cr, Ti, W, Mo, Hf, and Zr, as well as RF magnetron sputtering for dielectric materials. The system accommodates samples up to 4 inches in diameter, providing precise control over film quality and composition.