Contacts:
Arman Tuigynbek
Zhanibek Balgin
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Location:
C4, M021
Nanofabrication Facility:
The Nanofabrication Facility offers advanced micro- and nanoscale fabrication capabilities across a 70 m² cleanroom and a 40 m² technical area, with classifications ranging from ISO 6 to ISO 5. Equipped with tools for patterning, deposition, etching, and characterization, the facility supports a wide range of processes including thin film growth, photolithography, etching, and material analysis and provides researchers with the precision and controlled environment necessary for developing microelectronics, sensors, and nanostructured devices.
E-Beam & Thermal Evaporation System - PVD200 (Kurt J. Lesker):
The Kurt Lesker PVD200 is an electron beam and thermal evaporation system used for thin film deposition. It includes an 8-pocket, 10 kV electron beam source, two thermal evaporation sources, and a long-throw chamber that provides uniform deposition for lift-off applications. An automated load-lock allows for efficient sample transfer while maintaining vacuum conditions.
Atomic Layer Deposition II - FlexAl (Oxford Instruments):
The Oxford Instruments FlexAL ALD system combines remote plasma ALD for low-damage deposition with thermal ALD in a single chamber. It features in-situ ellipsometry for real-time thickness measurements and supports the deposition of materials such as Al₂O₃, AlN, HfO₂, ZrO₂, TiO₂, TiN, SiO₂, MoOx, and WOx. The system operates with Ar, N₂, H₂, and SF₆ as process gases, offering flexibility for a range of thin film applications.
PECVD (for a-Si/SiO2/SiNx) - PlasmaPro 80 (Oxford Instruments):
The Oxford Instruments PlasmaPro 80 is a plasma-enhanced chemical vapor deposition (PECVD) system designed for the deposition of silicon-based materials at lower temperatures compared to conventional CVD. It supports the deposition of amorphous silicon (a-Si), silicon nitride (SiNx), and silicon dioxide (SiO₂), making it suitable for applications requiring controlled film properties and reduced thermal impact.
Reactive Ion Etching - PlasmaPro 80 (Oxford Instruments):
The Oxford Instruments PlasmaPro 80 is a reactive ion etching (RIE) system with a parallel-plate capacitor configuration, designed for the controlled etching of Si, SiO₂, and SiNx up to 500 nm. It operates with Ar, O₂, SF₆, CF₄, and CHF₃ as process gases, allowing for precise material removal in micro- and nanofabrication applications.
Mask Aligner - MA6 (SUSS MicroTec):
The SUSS MA6 Mask Aligner is used for UV photolithography, featuring a 500 W Hg-Xe lamp with exposure wavelengths of 400 nm, 300 nm, and 250 nm (DUV). It supports constant power and constant dose exposure modes and accommodates sample sizes ranging from 5×5 mm pieces to 100 mm wafers, making it suitable for microfabrication and lithography applications.
Spin Coater - Polos (SPS):
The Polos SPS Spin Coater is used for thin film coating with a rotation speed range of 1 to 12,000 rpm and acceleration up to 30,000 rpm². It features a digital touchscreen interface and a stylus for operation, allowing precise control over coating parameters for applications in microfabrication and materials research.
Hotplate - Polos 200-S (SPS):
The SPS Polos 200-S Hotplate is used for precise thermal processing of substrates ranging from 100 to 200 mm. It operates within a temperature range of 50 to 230°C with an accuracy of ±0.5°C and allows heating durations from 1 to 999 seconds, making it suitable for applications such as photoresist baking and thin film processing.
Optical Microscope - Axioscope 5 (Carl Zeiss):
The Carl Zeiss Axioscope 5 is an upright optical microscope designed for routine analysis. It supports brightfield and darkfield imaging and is equipped with 5×, 10×, 20×, 50×, and 100× objectives, allowing for detailed examination of various samples in microfabrication and materials research.
Plasma Cleaner - PDC-002 (Harrick Plasma):
The Harrick Plasma PDC-002 is a 30W RF plasma cleaner used for surface cleaning and pretreatment. It operates with argon (Ar) and oxygen (O₂) as process gases, enabling effective removal of contaminants and surface modification for improved adhesion in microfabrication processes.
Wet Process Chemical Stations (Air Control):
The Air Control Wet Process Chemical Stations are fire- and chemical-resistant laminar flow fume hoods, designed specifically for wet chemical processing. These stations provide a controlled and safe environment for handling hazardous chemicals in various fabrication and research applications.
Vacuum Oven (Binder):
The Binder Vacuum Oven operates with a temperature range up to 220°C and offers a 24L chamber volume, making it ideal for drying and dehydrating materials under vacuum conditions, ensuring efficient and uniform processing.
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